Flip Chip Die Bonder
TED · 582477-2026Contract noticeCloses in 29 days · 2026-09-22
Buyer
NameFAIR - Facility for Antiproton and Ion Research in Europe GmbH
CountryDE
Published2026-08-24
Deadline2026-09-22
Value
Estimated—
Awarded—
Who already wins at this buyer
Firms with recorded awards from FAIR - Facility for Antiproton and Ion Research in Europe GmbH in this tender’s CPV categories — the incumbents you are bidding against.
| Firm | Wins | Awarded | Last win |
|---|---|---|---|
| Berthold Technologies GmbH & Co. KG | 1 | €337,510 | 2026-08-21 |
| Sirah Lasertechnik GmbH | 1 | €91,884 | 2026-06-17 |
CPV codes
38000000 Laboratory, optical & precision equipmentDescription
In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.
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