Silicon Austria Labs – Chips JU: Plasma Activation system for D2W bonding
TED · 540473-2026Award noticeawardedNo deadline given
Value
Estimated€790,621 · 790,621.28 EUR
Awarded€790,621 · 790,621.28 EUR
WinnerEV Group Europe & Asia/Pacific GmbH
Who already wins at this buyer
Firms with recorded awards from Silicon Austria Labs GmbH in this tender’s CPV categories — the incumbents you are bidding against.
| Firm | Wins | Awarded | Last win |
|---|---|---|---|
| Canon Europa N.V. | 1 | €10,718,844 | 2026-05-06 |
| Pac Tech – Packaging Technologies GmbH | 1 | €1,260,320 | 2026-06-03 |
| TELTEC Semiconductor Technic GmbH | 1 | €718,200 | 2026-07-10 |
| PulseForge, Inc. | 1 | €213,657 | 2026-06-11 |
| budatec GmbH | 1 | €176,641 | 2026-06-17 |
Full buyer profile: what Silicon Austria Labs GmbH buys and who wins it →
CPV codes
38000000 Laboratory, optical & precision equipmentDescription
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application for Silicon Austria Labs GmbH.