Manufacturing of monolithic sensors on undiced wafers
TED · 359370-2026Contract noticeClosed 42 days ago
Value
Estimated€3,642,324 · 40,000,000 SEK
Awarded—
CPV codes
31711100 Electrical machinery & lightingDescription
The assignment comprises the manufacture of sensors in which detector elements and CMOS-based readout and signal processing electronics are integrated in the same silicon structure, resulting in a monolithic component.
Similar tenders
Closest by meaning — across languages, via embeddings.
| Published | Title | Buyer | Match |
|---|---|---|---|
| 2026-06-26 | Manufacturing of monolithic sensors on undiced wafers | Kungliga Tekniska högskolan SE | 100% |
| 2026-07-23 | ENGINEERING SERVICES RELATED TO CMOS WAFERS ON FULLY DEPLETED SILICON-ON-INSULATOR | — BE | 86% |
| 2026-06-11 | FBH-02 Prior Information Notice – Wet Chemical Processing Tool (Single Wafer Etching) | Ferdinand-Braun-Institut gGmbH Leibniz-Institut für Höchstfrequenztechnik DE | 85% |
| 2026-05-28 | Supply of Integrated System for Measuring and Communication Analysis of Mono- and Bi-directional Electric Vehicle Charging Processes. | European Commission, DG JRC - Joint Research Centre IT | 85% |
| 2026-06-11 | Prior Information Notice – Wafer Dicing Equipment | Ferdinand-Braun-Institut gGmbH Leibniz-Institut für Höchstfrequenztechnik DE | 85% |
| 2026-08-04 | Picosecond ultrasonics film thickness measurement tool | TEKNOLOGIAN TUTKIMUSKESKUS VTT OY FI | 85% |