Silicon Austria Labs – Chips JU: Wafer bumper
TED · 378296-2026Award noticeawardedNo deadline given
Value
Estimated€1,260,320 · 1,260,320 EUR
Awarded€1,260,320 · 1,260,320 EUR
WinnerPac Tech – Packaging Technologies GmbH
Who already wins at this buyer
Firms with recorded awards from Silicon Austria Labs GmbH in this tender’s CPV categories — the incumbents you are bidding against.
| Firm | Wins | Awarded | Last win |
|---|---|---|---|
| EV Group Europe & Asia/Pacific GmbH | 3 | €3,963,131 | 2026-08-06 |
| Canon Europa N.V. | 1 | €10,718,844 | 2026-05-06 |
| TELTEC Semiconductor Technic GmbH | 1 | €718,200 | 2026-07-10 |
| Schmoll Maschinen GmbH | 1 | €469,747 | 2026-08-07 |
| PulseForge, Inc. | 1 | €213,657 | 2026-06-11 |
Full buyer profile: what Silicon Austria Labs GmbH buys and who wins it →
CPV codes
38000000 Laboratory, optical & precision equipmentDescription
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping tool as well as services such as trainings for Silicon Austria Labs GmbH.
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