Silicon Austria Labs – Chips JU: Wafer bumper
TED · 378296-2026can-standardawardedNo deadline given
Buyer
NameSilicon Austria Labs GmbH
CountryAT
Published2026-06-03
Deadline—
Value
Estimated€1,260,320 · 1,260,320 EUR
Awarded€1,260,320 · 1,260,320 EUR
WinnerPac Tech – Packaging Technologies GmbH
CPV codes
38000000 Laboratory, optical & precision equipmentDescription
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping tool as well as services such as trainings for Silicon Austria Labs GmbH.
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Records136,978 tendersNewest notice2026-06-24Last ingest2026-06-25 · TED daily 06:00Parser health (7d)all runs clean