Wafer metrology
Who already wins at this buyer
Firms with recorded awards from VTT Technical Research Centre of Finland Ltd in this tender’s CPV categories — the incumbents you are bidding against.
| Firm | Wins | Awarded | Last win |
|---|---|---|---|
| Iin Konepaja Oy | 1 | — | 2026-06-19 |
Full buyer profile: what VTT Technical Research Centre of Finland Ltd buys and who wins it →
CPV codes
38000000 Laboratory, optical & precision equipment38300000 Laboratory, optical & precision equipmentDescription
The object of the tender was semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool had to be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process was described in more detail in the invitation to tender documents.
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