Optical film stress measurement tool

CPV codes

Description

THE OBJECT OF THE TENDER PROCESS The object of the procurement is a 200 mm automated film stress and wafer bow analysis system using a non-contact laser scanning technique for the VTT Micronova cleanroom. The procurement includes a room temperature automated thin-film stress measurement system, cassette load lock, robot to handle the wafers, programmable automatic wafer scanning system, and analysis software. The tool should be designed to be used inside the clean room. The supplier will take to consideration the environmental conditions of the tool installation location and will work together with VTT to reduce the external impact on facility. The automated thin-film stress analysis system is for non-patterned, non-texture 200 mm wafer stress measurement. The technical specification of the object of the tender and its minimum requirements is described in more detail in this Annex 1 of the invitation to tender. The tendered Tool must comply with all technical properties and functionalities, performance specifications and acceptance criteria as set out in Annex 1 and Annex 2 (“Facilities, materials and connector types”). A tender which does not meet one or more of the requirements specified in the Annex 1 and Annex 2, may be rejected for failing to comply with the call for tenders. The comparison criterion for the tenders is economic advantageous (see section "Grounds for decision") with 80 % price weighting and 20 % quality weighting. A reference price has to be given for the equipment that meets all the requirements set in the invitation to tender, especially its Annex 1. Partial tenders will not be accepted. NON-MANDATORY OPTIONAL FEATURES Please see Annex 1 section 3.4.10 of the invitation to tender. The tenderer may offer the feature as an optional item in its tender. PLEASE NOTE: the optional item shall not be included in the comparison price of the device but shall be priced separately.

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