Notice of discontinuation: Edge-Handling Sputtering Cluster Tool
Value
Estimated—
Awarded—
Who already wins at this buyer
Firms with recorded awards from VTT Technical Research Centre of Finland Ltd in this tender’s CPV categories — the incumbents you are bidding against.
| Firm | Wins | Awarded | Last win |
|---|---|---|---|
| Iin Konepaja Oy | 2 | €337,310 | 2026-09-07 |
| Sales Department | 1 | €1,256,300 | 2026-09-03 |
| Confovis GmbH | 1 | €1,190,000 | 2026-10-14 |
| FRT GmbH | 1 | €464,674 | 2026-08-31 |
| Concept Scientific Instruments | 1 | €177,100 | 2026-09-14 |
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CPV codes
38000000 Laboratory, optical & precision equipmentDescription
The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”). The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering sources. During transport and processing, the wafers are mechanically touched only at the wafer edge, and they can be flipped in vacuum between the processes. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.
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