Automated 300 mm Die-to-Wafer thermocompression bonding tool - PR1275392-3460-W
TED · 756518-2026Contract noticeNo deadline given
Value
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Who already wins at this buyer
Firms with recorded awards from Fraunhofer-Gesellschaft, Einkauf B12 in this tender’s CPV categories — the incumbents you are bidding against.
| Firm | Wins | Awarded | Last win |
|---|---|---|---|
| Advantest Europe GmbH | 1 | — | 2026-08-13 |
| BÜTOW Industrie-Elektronik GmbH | 1 | — | 2026-10-23 |
| EUMETRYS GmbH | 1 | — | 2026-06-02 |
| HQ-Dielectrics GmbH | 1 | — | 2026-09-18 |
| WIKA Alexander Wiegand SE & Co. KG | 1 | — | 2026-09-10 |
Full buyer profile: what Fraunhofer-Gesellschaft, Einkauf B12 buys and who wins it →
CPV codes
31712000 Electrical machinery & lightingDescription
PR1275392-3460-W Automated 300 mm Die-to-Wafer thermocompression bonding tool
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