Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P
TED · 500022-2026Contract noticeCloses in 3 days · 2026-07-24
Buyer
Name—
CountryDE
Published2026-07-20
Deadline2026-07-24
Value
Estimated—
Awarded—
CPV codes
42990000 Industrial machineryDescription
Die-to-Wafer Bonder (IPMS-MRS14.1)
Similar tenders
Closest by meaning — across languages, via embeddings.
| Published | Title | Buyer | Match |
|---|---|---|---|
| 2026-06-25 | Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P | — DE | 100% |
| 2026-05-27 | Laser-Debonder and Cleaner (IPMS-MRS13.2) - PR981920-2480-P | — DE | 91% |
| 2026-05-27 | Bonder & Coater incl. Hotplate/Coolplate (IPMS-MRS13.1 & IPMS-MRS13.4) - PR1048742-2480-P | — DE | 90% |
| 2026-05-11 | Plasma Activation Tool (IPMS-MRS14.3) - PR1091613-2480-P | — DE | 89% |
| 2026-07-13 | Wafer Bonder for oxidfree bonding process - PR941467-3340-P (ENAS-05) | Fraunhofer-Gesellschaft - Einkauf B12 DE | 88% |
| 2026-05-19 | Automated wafer prober (IMS-04) - PR1119714-2380-P | Fraunhofer-Gesellschaft - Einkauf B12 DE | 88% |