Silicon Austria Labs – Laser drilling machine for fan-out wafer level packaging
TED · 549012-2026Award noticeawardedNo deadline given
Value
Estimated€469,747 · 469,747 EUR
Awarded€469,747 · 469,747 EUR
WinnerSchmoll Maschinen GmbH
Who already wins at this buyer
Firms with recorded awards from Silicon Austria Labs GmbH in this tender’s CPV categories — the incumbents you are bidding against.
| Firm | Wins | Awarded | Last win |
|---|---|---|---|
| EV Group Europe & Asia/Pacific GmbH | 3 | €3,963,131 | 2026-08-06 |
| Canon Europa N.V. | 1 | €10,718,844 | 2026-05-06 |
| Pac Tech – Packaging Technologies GmbH | 1 | €1,260,320 | 2026-06-03 |
| TELTEC Semiconductor Technic GmbH | 1 | €718,200 | 2026-07-10 |
| PulseForge, Inc. | 1 | €213,657 | 2026-06-11 |
Full buyer profile: what Silicon Austria Labs GmbH buys and who wins it →
CPV codes
38000000 Laboratory, optical & precision equipmentDescription
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a laser drilling machine for fan-out wafer level packaging for Silicon Austria Labs GmbH.
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