Clustertool for Ion Beam Etching of 300mm wafers
TED · 476033-2026Award noticeawardedNo deadline given
Buyer
NameFraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
CountryDE
Published2026-07-10
Deadline—
Who already wins at this buyer
Firms with recorded awards from Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. in this tender’s CPV categories — the incumbents you are bidding against.
| Firm | Wins | Awarded | Last win |
|---|---|---|---|
| aTV Systems GmbH | 1 | €0 | 2026-07-08 |
| EV Group E. Thallner GmbH | 1 | €0 | 2026-05-05 |
CPV codes
42900000 Industrial machineryDescription
The tender item is an ion beam etching process tool to be used for 300mm wafer fabrication at the FRAUNHOFER IPMS. The systems will be used for the processing of CMOS wafers in a cleanroom class 1000 (approximately class 6 EN ISO 14644-1) production environment. Therefore, it is necessary to fulfill require-ments regarding metal contamination and particle generation compatible with industry standards.