Hybrid Wafer Bonding
TED · 546056-2026Award noticeawardedNo deadline given
Value
Estimated—
Awarded€2,797,834 · 2,797,834 EUR
WinnerEV Group Europe & Asia/Pacific GmbH
Who already wins at this buyer
Firms with recorded awards from Silicon Austria Labs GmbH in this tender’s CPV categories — the incumbents you are bidding against.
| Firm | Wins | Awarded | Last win |
|---|---|---|---|
| EV Group Europe & Asia/Pacific GmbH | 2 | €1,165,297 | 2026-08-06 |
| Canon Europa N.V. | 1 | €10,718,844 | 2026-05-06 |
| Pac Tech – Packaging Technologies GmbH | 1 | €1,260,320 | 2026-06-03 |
| TELTEC Semiconductor Technic GmbH | 1 | €718,200 | 2026-07-10 |
| PulseForge, Inc. | 1 | €213,657 | 2026-06-11 |
Full buyer profile: what Silicon Austria Labs GmbH buys and who wins it →
CPV codes
38000000 Laboratory, optical & precision equipmentDescription
Ziel dieses Vergabeverfahrens ist es, den im Rahmen des Verfahrens zu ermittelnden Bestbieter für die Lieferung, Installation, Inbetriebnahme sowie die Erbringung von Dienstleistungen für ein Hybrid-Wafer-Bonding-System auszuwählen.
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