Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P

TED · 434171-2026cn-standardCloses in 29 days · 2026-07-24

Buyer

Name—

CountryDE

Published2026-06-25

Deadline2026-07-24

Estimated—

Awarded—

42990000 Industrial machinery

Die-to-Wafer Bonder (IPMS-MRS14.1)

Closest by meaning — across languages, via embeddings.

Published	Title	Buyer	Match
2026-05-27	Laser-Debonder and Cleaner (IPMS-MRS13.2) - PR981920-2480-P	— DE	91%
2026-05-27	Bonder & Coater incl. Hotplate/Coolplate (IPMS-MRS13.1 & IPMS-MRS13.4) - PR1048742-2480-P	— DE	90%
2026-05-11	Plasma Activation Tool (IPMS-MRS14.3) - PR1091613-2480-P	— DE	89%
2026-05-19	Automated wafer prober (IMS-04) - PR1119714-2380-P	Fraunhofer-Gesellschaft - Einkauf B12 DE	88%
2026-06-02	Advanced cleaning tool (IPMS-MRS09.2) - PR1119624-2480-P	— DE	88%
2026-05-20	Single wafer cleaning tool (IMS-11) - PR1158786-2380-P	Fraunhofer-Gesellschaft - Einkauf B12 DE	87%