Prior Information Notice – Wafer Dicing Equipment
Buyer
NameFerdinand-Braun-Institut gGmbH Leibniz-Institut für Höchstfrequenztechnik
CountryDE
Published2026-06-11
Deadline—
Value
Estimated€275,000 · 275,000 EUR
Awarded—
CPV codes
42990000 Industrial machineryDescription
The Ferdinand-Braun-Institut (FBH) plans to procure mechanical wafer dicing equipment for backend processing within the framework of its ongoing infrastructure development activities. The system will be used for the separation of semiconductor wafers into individual chips (dicing). It shall support wafers up to 200 mm in diameter and be suitable for various semiconductor materials such as Si, SiC, GaN, InP and GaAs. The equipment is intended to ensure precise and reproducible dicing processes using mechanical blade-based technology. It will be installed in a cleanroom environment and must be compatible with ISO class 7 requirements. The procurement procedure is planned for 2026.
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