Blade Dicing Saw
Who already wins at this buyer
Firms with recorded awards from Danmarks Tekniske Universitet - DTU in this tender’s CPV categories — the incumbents you are bidding against.
| Firm | Wins | Awarded | Last win |
|---|---|---|---|
| Ramcon A/S | 2 | €344,339 | 2026-08-13 |
| LanzaTech Inc | 1 | €15,496,768 | 2026-05-11 |
| Zero Point Cryogenics | 1 | €665,374 | 2026-06-25 |
| SAS OPTIQUE HENRI PETER | 1 | €148,000 | 2026-07-02 |
| BioNavis Ltd | 1 | €133,171 | 2026-05-13 |
Full buyer profile: what Danmarks Tekniske Universitet - DTU buys and who wins it →
CPV codes
38000000 Laboratory, optical & precision equipmentDescription
DTU Nanolab intends to procure a semi-automatic wafer dicing system for research and cleanroom operations. The equipment must be capable of processing wafers up to 300 mm diameter and support conventional wafer dicing, circular wafer cutting, multi-circular cutting, and edge trimming of circularly cut wafers to improve mechanical strength and handling robustness. The system must also be capable of processing hard and thick materials used in advanced microfabrication and semiconductor research, including materials such as silicon carbide (SiC) and piezoelectric substrates. The equipment will be installed and operated in DTU Nanolab's multi-user cleanroom environment and will support research, innovation, and industrial collaboration activities.
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